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FAI FULLY AUTOMATIC FLYING PROBE FIRST ARTICLE INSPECTION MACHINE
FAI FULLY AUTOMATIC FLYING PROBE FIRST ARTICLE INS

FAI Fully Automatic Flying Probe First Article Inspection Machine DX-X9

FAI Fully Automatic Flying Probe First Article Inspection Machine DX-X9
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FAI Fully Automatic Flying Probe First Article Inspection Machine DX-X9

The DX-X9 fully automatic flying probe first article inspection machine only requires one set of flying probes to automatically switch spans and automatically test LCR components with different packages. It is an automated device that revolutionizes traditional manual clamp measurement, with an efficiency more than three times that of traditional first article testers. It is highly efficient, accurate, and saves time and effort.

The DX-X9 fully automatic flying probe first article inspection machine only requires one set of flying probes to automatically switch spans and automatically test LCR components with different packages. It is an automated device that revolutionizes traditional manual clamp measurement, with an efficiency more than three times that of traditional first article testers. It is highly efficient, accurate, and saves time and effort.

Fast programming speed

The system automatically recognizes customer BOM and CAD, automatically identifies component spans, and generates inspection programs in just 3 minutes.image.png

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System automatically changes span

With just one set of probes, the span is automatically adjusted according to the component, and automatic clamping testing is performed to indirectly compare whether the material and packaging are consistent.
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Automatic flying probe testing, automatic determination of test results

The system automatically switches test modes, automatically compares with the BOM, and automatically determines test results.
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Automatic identification and determination of silk screen printing, direction, and polarity

The system uses high-definition camera recognition to automatically determine the silk screen printing, direction, and polarity of chips, diodes, and transistors.
Automatic recognition of empty sticker components
Fully automatic rapid identification of empty components, automatic detection of multiple components
Automatically generate test reports with traceability
Once testing is complete, a test report can be automatically generated, which can be archived and printed.